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COPRA LS9
The COPRA LS9 was first released in the year of 2004, especially developed for the encapsulation of OLEDs. Today it is a working horse for all kinds of plasma processing like PECVD, chemical etching and bias enhanced ion milling on flat substrates of a size up to 360mm times 360mm i.e. 14” square.  This size fits to a batch of four 6” standard silicon wafer of the solar industry where it is widely used for the deposition of Antireflective “AR”- coatings.
 
LS9
LS9
 
Substrate 330mm x 300mm
Pressure Range 5E-4 to 1mbar
Gases any
RF-Power max. 5000 Watt
RF Matching Remote
Ion Energy below 50 eV
Curent Density up to 1mA/cm2
Extraction Grid less
 
Apps PECVD