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COPRA DN400 and DN500
The COPRA DN400 and DN500 were originally designated for 200mm and 300mm wafer processing to form ultrathin Aluminum Oxides and Nitrides barrier. Today the DN400 and DN500 are additionally used for PECVD and Etching applications on all kind of flat substrates. Beside this face to face operation both type of source are also successfully established as PECVD assist sources in optical coating system with chamber diameters of up 1800mm

Substrate Size

up to 8" for DN400
up to 12" for DN500
DN400
DN400 and 500
Dimension DN400 DN500
Pressure Range 1E-4 to 1E-2mbar A [mm[ 430 569
Gases Any B [mm] 410 539
RF-Power max. 5000 Watt C [mm] 388 397
Ion Energy up to 250 eV D [mm] 20 22
Current Density up to 3 mA/ cm2 E [mm] 394 514
Extraction Grounded W-Grid F [mm] 12 21
Apps
E-gun assist
Wafer Processing

Extration G [mm]

266

398